Cluster Clip / Top Clip Application System
Our Cluster Clip and Top Clip Application System was engineered to automate the application of plastic or cardboard clips with speed, accuracy, and consistency. Designed for high volume packaging environments, this system streamlines the clip application process while maintaining precise placement across a wide range of bottle and jar sizes and configurations.
By replacing manual or inconsistent clip application methods, the system improves production efficiency and reduces variability on the packaging line. Its flexible design allows it to adapt to different bottle formats and clip styles, making it well suited for manufacturers serving multiple products or industries. Each application cycle is carefully controlled to ensure repeatable results at high operating speeds.
The system is built with durability and ease of use in mind. Intuitive operator controls and straightforward maintenance access help minimize downtime and simplify day to day operation. Robust construction and integrated safety features ensure reliable performance in demanding production environments while maintaining a clean and organized workspace.
Ideal for manufacturers looking to increase throughput, improve packaging quality, and reduce manual handling, the Cluster Clip and Top Clip Application System reflects IC Automation’s commitment to delivering practical automation solutions. It provides a reliable and efficient path to modernizing packaging operations while supporting long term production goals.
Looking to simplify or automate your manufacturing process?
Whether you’re just exploring options or ready to take the next step, our team is here to help. We make automation approachable and tailored to your needs. Reach out today and let’s start the conversation.
Address
6441 Davis Industrial Parkway
Solon, Ohio, 44139
United States
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